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acpm-7371 umts 4x4 power amplifer (880-9 5mhz) data sheet description thef acpm-7371,f af wide-bandf codef divisionf multiplef access(wcdma)fpowerfampliferf(pa),fisfaffullyfmatchedf 10-pinf surfacef mountf modulef developedf forf wcdmaf handsetf applications.f thisf powerf ampliferf modulef isf developedftofcoverf880-915mhzfbandwidth.fthefacpm- 7371fmeetsfthefstringentfwcdmaflinearityfrequirementsf forfoutputfpowerfoffupftof28dbm.fthefacpm-7371fisfalsof developedftofmeetfhsdpafspecsfupftof27.5dbm.f thefacpm-7371fisfdesignedftofenhancefthefefciencyfatf lowf andf mediumf outputf powerf rangef byf usingf 3-modef controlf schemef withf 2f modef controlf pins.fthisf providesf extendedftalkftime.f thef acpm-7371f isf selff contained,f incorporatingf 50 w f inputfandfoutputfmatchingfnetworks. order information part number no. of devices container ACPM-7371-TR1 1000 7ftapefandfreel acpm-7371-blk 100 bulk functional block diagram features ? f excellentflinearityf ? f lowfquiescentfcurrent ? f highfefciency ? f 10-pinfsurfacefmountingfpackage f (4mmx4mmx1.1mmftyp) ? f internalf50 w fmatchingfnetworksfforfbothfrffinputfandf output ? f rohsfcompliant applications ? f wcdmafhandsetf(hsdpa) v c c 2 ( 6 ) o u t p u t m a t c h i n p u t m a t c h i n t e r s t a g e m a t c h d a p a r f i n p u t ( 4 ) r f o u t p u t ( 8 ) v c c 1 ( 5 ) v e n ( 1 ) v m o d e 0 ( 2 ) m o d u l e m m i c v m o d e 1 ( 3 ) b i a s c i r c u i t & c o n t r o l l o g i c t r s w i t c h
table 1. absolute maximum ratings nofdamagefassumingfonlyfonefparameterfisfsetfatflimitfatfaftimefwithfallfotherfparametersfsetfatforfbelowftypicalfvalue. operationf off anyf singlef parameterf outsidef thesef conditionsf withf thef remainingf parametersf setf atf orf belowf typicalf valuesfmayfresultfinfpermanentfdamage parameter min typ max unit associated pins rffinputfpower Cf Cf 10.0 dbm rfin dcfsupplyfvoltage 0f 3.4 5.0 v vcc1,fvcc2 enablefvoltage 0f 2.6 3.3 v ven modefcontrolfvoltage 0 1.9 3.3 v vmode0,ffvmodef1 storageftemperature -55 Cf +125 c table 2. recommended operating condition parameter min nominal max unit dcfsupplyfvoltage 3.2 3.4f 4.2 v enablefvoltage f (ven) low high f 0 1.9 0.5 2.6 0.5 2.9 v modefcontrolfvoltagef f (vmode0,fvmode1) low high 0 1.8 0 1.9 0.5 2.9 v operatingffrequency 880 915 mhz ambientftemperature -20 25 90 c table 3. power range truth table power mode ven vmode0 vmode1 range highfpowerfmode high low low ~f28dbmf(wcmda) midfpowerfmode high high low ~f16dbm lowfpowerfmode high high high ~f8dbm shutfdownfmode low C - C
table 4. electrical characteristics for wcdma mode vcc=3.4v,fven=2.6v,fvmode0fandfvmode1=f0vforf1.9v,fft=25c,fzin/zout=50 w f signalfconfguration:f3gppfuplinkfdpcchf+f1dpdch characteristics condition min. typ. max. unit operatingffrequencyfrange f 880 C 915 mhz gain highfpowerfmode,fpout=28.0fdbmf 23.5 26.5 db midfpowerfmode,fpout=16.0fdbm 12.5 17 db lowfpowerfmode,fpout=8.0fdbm 11.5 16 db powerfaddedfefciency highfpowerfmode,fpout=28.0fdbmf 35.3 40.0 % midfpowerfmode,fpout=16.0fdbm 10.4 14.3 % lowfpowerfmode,fpout=8.0fdbm 3.3 5.2 % totalfsupplyfcurrent highfpowerfmode,fpout=28.0fdbmf 463 535 ma midfpowerfmode,fpout=16.0fdbm 80 110 ma lowfpowerfmode,fpout=8.0fdbm 35 55 ma quiescentfcurrent highfpowerfmode 96 120 ma midfpowerfmode 18 24 ma lowfpowerfmode 13 18 ma enablefcurrent highfpowerfmode 0.18 1 ma midfpowerfmode 0.18 1 ma lowfpowerfmode 0.18 1 ma controlfcurrent midfpowerfmodef(imode0) 0.4 1 ma lowfpowerfmodef(imode1) 0.18 1 ma lowfpowerfmodef(imode0) 0.4 1 ma totalfcurrentfinfpower-downfmode ven=0v 0.2 5 a adjacentfchannelf leakagefratio f5fmhzfofset 10fmhzfofset highfpowerfmode,fpout=28.0fdbmf -41 -54 -36 -46 dbc f5fmhzfofset 10fmhzfofset midfpowerfmode,fpout=16.0fdbm -48 -61 -36 -46 dbc f5fmhzfofset 10fmhzfofset lowfpowerfmode,fpout=8.0fdbm -40 -56 -36 -46 dbc harmonic f suppression 2fo 3fo highfpowerfmode,fpout=28.0fdbm -30 -45 dbc inputfvswr vswr 2.5:1 stabilityf(spuriousfoutput) vswrf5:1,fallfphase -60 dbc noisefpowerfinfrxfband highfpowerfmode,fpout=28.0fdbmf -132 -130 dbm/hz phasefdiscontinuity lowfpowerfmodef<-->fmidfpowerf mode,fatfpout=8dbm 10 deg midfpowerfmodef<-->fhighfpowerf mode,fatfpout=16dbm 30 deg ruggedness pout<28.0dbm,fpin<10dbm,fallfphase highfpowerfmodef 10:1 vswr
4 table 5. electrical characteristics for hsdpa mode vcc=3.4v,fven=2.6v,fvmode0fandfvmode1=0vforf1.9v,ft=25 c, zin/zout=50 c , zin/zout=50 ,fzin/zout=50 w signalfconfguration:fdpcch/dpdch=12/15,fhs-dpcch/dpdch=15/15 characteristics condition min. typ. max. unit operatingffrequencyfrange 880 C 915 mhz gain highfpowerfmode,fpoutf=f27.5fdbmf 23.5 26 db midfpowerfmode,fpoutf=f16.0fdbm 12.5 17 db lowfpowerfmode,fpoutf=f8.0fdbm 11.5 16 db powerfaddedfefciency highfpowerfmode,fpoutf=f27.5fdbmf 33.7 36.7 % midfpowerfmode,fpoutf=f16.0fdbm 10.4 14.7 % lowfpowerfmode,fpoutf=f8.0fdbm 3.3 5.2 % totalfsupplyfcurrent highfpowerfmode,fpoutf=f27.5fdbmf 450 490 ma midfpowerfmode,fpoutf=f16.0fdbm 78 110 ma lowfpowerfmode,fpoutf=f8.0fdbm 35 55 ma adjacentfchannelf leakagefratio f5fmhzfofset 10fmhzfofset highfpowerfmode,fpoutf=f27.5fdbmf C -40 -52 -36 -46 dbc dbc f5fmhzfofset 10fmhzfofset midfpowerfmode,fpoutf=f16.0fdbm C -44 -58 -36 -46 dbc dbc f5fmhzfofset 10fmhzfofset lowfpowerfmode,fpoutf=f8.0fdbm C -40 -56 -36 -46 dbc dbc
5 0 5 10 15 20 25 30 -10 0 10 20 30 pout (dbm) gain (db) 0 50 100 150 200 250 300 350 400 450 500 -10 0 10 20 30 pout (dbm) current (ma) 0 5 10 15 20 25 30 35 40 45 -10 0 10 20 30 pout (dbm) pae (%) -60 -55 -50 -45 -40 -35 -30 -10 0 10 20 30 pout (dbm) aclr1 (dbc) -80 -75 -70 -65 -60 -55 -50 -45 -40 -10 0 10 20 30 pout (dbm) aclr2 (dbc) 880mhz 898mhz 915mhz 880mhz 898mhz 915mhz 880mhz 898mhz 915mhz 880mhz 898mhz 915mhz 880mhz 898mhz 915mhz characteristics data wcdma,fvcc=3.4v,fven=2.6v,fvmode0fandfvmode1=0vforf1.9v,ft=25,fzin/zout=50 w figure 5. adjacent channel leakage ratio 2 vs. output power figure 4. adjacent channel leakage ratio 1 vs. output power figure 3. power added efciency vs. output power figure 1. gain vs. output power figure 2. total current vs. output power
evaluation board description figure 6. evaluation board schematic figure 7. evaluation board assembly diagram figure 8. marking specifcations 1 v e n 2 v m o d e 0 3 v m o d e 1 4 r f i n 5 v c c 1 g n d 1 0 g n d 9 r f o u t 8 g n d 7 v c c 2 6 v e n v m o d e 0 r f i n v c c 1 v c c 2 r f o u t c 1 1 0 0 p f c 2 1 0 0 p f c 7 2 . 2 u f c 6 5 6 0 p f c 4 5 6 0 p f c 5 2 . 2 u f v m o d e 1 c 3 1 0 0 p f p i n 1 m a r k a v a g o a c p m - 7 3 7 1 p y y w w a a a a a a a a m a n u f a c t u r i n g p a r t n u m b e r l o t n u m b e r p m a n u f a c t u r i n g i n f o y y m a n u f a c t u r i n g y e a r w w w o r k w e e k a a a a a a a a a s s e m b l y l o t n u m b e r c 3 c 2 c 1 c 6 c 4 c 5 c 7 a v a g o a c p m - 7 3 7 1 p y y w w a a a a a a a a g n d v e n v c c 1 v c c 2 g n d g n d v m o d e 1 v m o d e 0
figure 9. package dimensional drawing and pin descriptions (all dimensions are in millimeters) package dimensions and pin descriptions x-ray bottom view 5 2 3 4 10 6 9 8 7 4.0 0.1 pin 1 mark 0.70 typ. 1 4.0 0.1 1.1 0.1 1 . 9 0 1 . 7 0 0 . 8 5 1 . 2 0 1 . 9 0 0 . 4 0 0 . 4 0 pin descriptions pin # name description 1 ven enablefvoltage 2 vmode0 controlfvoltage 3 vmode1 controlfvoltage 4 rfin rffinput 5 vcc1 supplyfvoltage 6 vcc2 supplyfvoltage 7 gnd ground 8 rffout rffoutput 9 gnd ground 10 gnd ground side view top view
8 coolpam avagoftechnologiesfcoolpamfisfstage-bypassfpaftechnol - ogyfwhichfsavesfmorefpowerfcomparedfwithfconvention - alfpa.fwithfthisftechnology,fthefacpm-7371fhasfveryflowf quiescentf currentf andf efcienciesf atf lowf andf mediumf outputfpowerfrangesfarefveryfhigh.f incorporation of bias circuit thef acpm-7371f hasf internalf biasf circuit,f whichf removesf thef needf forf externalf constantf voltagef sourcef (ldo).f paf on/offisfcontrolledfbyfven.fthisfisfdigitallyfcontrolfpin. 3-mode power control with two mode control pins thefacpm-7371fsupportsfthreefpowerfmodesf(lowfpowerf mode/midf powerf mode/highf powerf mode)f withf twof modef controlf pinsf (vmode0f andf vmode1).f thisf controlf schemef enablesf thef acpm-7371f tof savef moref power,f whichfaccordinglyfgivesfextendedftalkftime. pdff (probabilityf densityf function)f inf belowf fguref showingf distributionf off outputf powerf off mobilef inf realf feldfgivesfmotivationfforfstage-bypassfpa.foutputfpowerf isf lessf thanf 16dbmf forf mostf off operatingf timef (duringf talking),fsofitfisfimportantftofsavefpowerfconsumptionfatf lowfandfmediumfoutputfpowerfranges.f average current & talk time averagef currentf consumedf byf paf canf bef calculatedf byf summingf upf currentf atf eachf outputf powerf weightedf withf probability.f sof itf isf expressedf withf integrationf off multiplicationfoffcurrentfandfprobabilityfatfeachfoutputf power.fff talkftimefisfextendedfmorefasfaveragefcurrentfconsump - tionfisflowered. mode control pins vmode0f andf vmode1f aref digitallyf controlledf pinsf andf theyf controlf operatingf modef off paf andf truthf tablef isf summarizedf inf tablef 3.f thesef pinsf dof notf requiref constantfvoltagefforfinterface,fandf1.9vfisfrecommendfatf vmode0fandfvmode1fpins.ff application on mobile board belowffgurefshowsfonefapplicationfexamplefonfmobile.f c4f andf c5f shouldf bef placedf nearbyf pin1f andf pin10.f transmissionf linef lengthf afterf paf outputf shouldf bef minimizedf tof reducef conductionf loss.f whenf outputf voltagef off modef controlf pinsf atf base-bandf chipsetf isf 2.6v,f seriesf resistorf off 2kohmf isf recommendedf forf vmode0fandf4.7kohmfforfvmode1. figure 10. pdf and current c 7 c 8 b b c 3 l 1 o u t p u t m a t c h i n g c i r c u i t a c p m - 7 3 7 1 p a _ r 1 p a _ r 0 p a _ o n c 2 t x l t e r r f i n c o u p l e r r f o u t c 1 c 9 c 6 v b a t t c 4 c 5 r 2 4 . 7 k r 1 2 k ven vmode0 vmode1 in vcc1 vcc2 gnd gnd gnd out figure 11. acpm-7371 application example
9 figure 14. solder paste stencil aperture figure 13. solder mask opening figure 12. metallization pcb design guidelines thef recommendedf acpm-7371f pcbf landf patternf isf shownfinffiguref12fandffigure13.fthefsubstratefisfcoatedf withfsolderfmaskfbetweenfthefi/ofandfconductivefpaddlef tofprotectfthefgoldfpadsffromfshortfcircuitfthatfisfcausedf byfsolderfbleeding/bridging.ff stencil design guidelines af properlyf designedf solderf screenf orf stencilf isf requiredf tofensurefoptimumfamountfoffsolderfpastefisfdepositedf ontof thef pcbf pads.f thef recommendedf stencilf layoutf isf shownfinffigure14.freducingfthefstencilfopeningfcanfpo - tentiallyfgeneratefmorefvoids.fonfthefotherfhand,fstencilf openingsf largerf thanf 100%f willf leadf tof excessivef solderf pastef smearf orf bridgingf acrossf thef i/of padsf orf conduc - tivef paddlef tof adjacentf i/of pads.f consideringf thef factf thatfsolderfpastefthicknessfwillfdirectlyfafectfthefqualityf offthefsolderfjoint,fafgoodfchoicefisftofuseflaserfcutfstencilf composedf off 0.10mmf (4mils)f orf 0.127mmf (5mils)f thickf stainlessfsteelfwhichfisfcapablefoffproducingfthefrequiredf fnefstencilfoutline. 0.25 0.85 0.4 0.6 0.5 0.1 ? 0.3mm on 0.6mm pitch 0.7 0.5 0.55 0.85 2.4 1.8 0. 6 0. 5 1. 6 2. 0 0. 85 0. 4
0 figure 15. tape and reel format C 4 mm x 4 mm. annote millimeter annote millimeter a0 4.400.10 p2 2.000.05 b0 4.400.10 p10 40.000.20 k0 1.700.10 e 1.750.10 d0 1.550.05 f 5.500.05 d1 1.600.10 w 12.000.30 p0 4.000.10 t 0.300.05 p1 8.000.10 a v a g o a c p m - 7 3 7 1 p y y w w a a a a a a a a tape and reel information
reel drawing figure 16. plastic reel format (all dimensions are in millimeters) notes: 1. reel shall be labeled with the following information (as a minimum). a. manufacturers name or symbol b. avago technologies part number c. purchase order number d. date code e. quantity of units 2. a certi?cate of compliance (c of c) shall be issued and accompany each shipment of product. 3. reel must not be made with or contain ozone depleting materials. 4. all dimensions in millimeters (mm) 50 min. 12.4 +2.0 -0.0 18.4 max. 25 min wide (ref) slot for carrier tape insertion for attachment to reel hub (2 places 180 apart) back view front view 178 shading indicates thru slots +0.4 -0.2 21.0 0.8 13.0 0.2 1.5 min.
table 6. moisture classifcation level and floor life msl level floor life (out of bag) at factory ambient 30 c /60% rh or as stated 1 unlimitedfatf f30c/85%frh 2 1fyear 2a 4fweeks 3 168fhours 4 72fhours 5 48fhours 5a 24fhours 6 mandatoryfbakefbeforefuse.fafterfbake,fmustfbefrefowedfwithinftheftimeflimitfspecifedfonftheflabel notef: 1.f thefmslflevelfisfmarkedfonfthefmslflabelfonfeachfshippingfbag. handling and storage esd (electrostatic discharge) electrostaticf dischargef occursf naturallyf inf thef environ - ment.fwithfthefincreasefinfvoltagefpotential,fthefoutletfoff neutralizationforfdischargefwillfbefsought.fiffthefacquiredf dischargef routef isf throughf af semiconductorf device,f de - structivefdamagefwillfresult. esdfcountermeasurefmethodsfshouldfbefdevelopedfandf usedftofcontrolfpotentialfesdfdamagefduringfhandlingfinf affactoryfenvironmentfatfeachfmanufacturingfsite. msl (moisture sensitivity level) plasticf encapsulatedf surfacef mountf packagef isf sensitivef tofdamagefinducedfbyfabsorbedfmoisturefandftempera - ture. avagoftechnologiesffollowsfjedecfstandardfj-stdf020b.f eachf componentf andf packagef typef isf classifedf forf moisturef sensitivityf byf soakingf af knownf dryf packagef atf variousf temperaturesf andf relativef humidity,f andf times.f afterf soak,f thef componentsf aref subjectedf tof threef con - secutivefsimulatedfrefows.f thef outf off bagf exposuref timef maximumf limitsf aref de - terminedfbyfthefclassifcationftestfdescribefbelowfwhichf correspondsftofafmslfclassifcationflevelf6ftof1faccordingf tofthefjedecfstandardfipc/jedecfj-std-020bfandfj-std- 033. acpm-7381f isf msl3.f thus,f accordingf tof thef j-std-033f p.11f thef maximumf manufacturersf exposureftimef (met)f forfthisfpartfisf168fhours.fafterfthisftimefperiod,fthefpartf wouldf needf tof bef removedf fromf thef reel,f de-tapedf andf thenf re-baked.f mslf classifcationf refowf temperaturef forf thefacpm-7381fisftargetedfatf260f+0/-5c.ffiguref17fandf tablef7fshowftypicalfsmtfproflefforfmaximumftempera - turefoff260f+0/-5c.f
table 7. typical smt refow profle for maximum temperature = 260+0 / -5 c profle feature sn-pb solder pb-free solder averageframp-upfratef(tlftoftp) 3c/secfmax 3fc/secfmax preheat f-ftemperaturefminf(tsmin) f-ftemperaturefmaxf(tsmax) f-ftimef(minftofmax)f(ts) 100c 150c 60-120fsec 150c 200c 60-180fsec tsmaxftoftl f-framp-upfrate 3cf/secfmax timefmaintainedfabove: f-ftemperaturef(tl) f-ftimef(tl) 183c 60-150fsec 217c 60-150fsec peakftemperaturef(tp) 240f+0/-5c 260f+0/-5c timefwithinf5cfoffactualfpeakftemperaturef(tp) 10-30fsec 20-40fsec ramp-downfrate 6cf/secfmax 6cf/secfmax timef25cftofpeakftemperature 6fminfmax. 8fminfmax. figure 17. typical smt refow profle for maximum temperature = 260 +0/-5 c 25 time temperature tp t l tp t l t 25c to peak ramp-up ts ts min ramp-down preheat critical zone t l to tp ts max
4 storage condition packagesf describedf inf thisf documentf mustf bef storedf inf sealedf moisturef barrier,f antistaticf bags.f shelff lifef inf af sealedf moisturef barrierf bagf isf 12f monthsf atf <40cf andf 90%frelativefhumidityf(rh)fj-std-033fp.7. out-of-bag time duration afterfunpackingfthefdevicefmustfbefsolderedftofthefpcbf withinf 168f hoursf asf listedf inf thef j-std-020bf p.11f withf factoryfconditionsf<30cfandf60%frh. baking itfisfnotfnecessaryftofre-bakefthefpartfiffbothfconditionsf (storagefconditionsfandfout-offbagfconditions)fhavefbeenf satisfed.fbakingfmustfbefdonefiffatfleastfonefoffthefcon - ditionsfabovefhavefnotfbeenfsatisfed.fthefbakingfcondi - tionsfaref125cfforf12fhoursfj-std-033fp.8. caution tapefandfreelfmaterialsftypicallyfcannotfbefbakedfatfthef temperaturef describedf above.f iff out-of-bagf exposuref timefisfexceeded,fpartsfmustfbefbakedfforfaflongerftimef atflowftemperatures,forfthefpartsfmustfbefde-reeled,fde- taped,fre-bakedfandfthenfputfbackfonftapefandfreel.f(seef moisturef sensitivef warningf labelf onf eachf shippingf bagf forfinformationfoffbaking). board rework component removal, rework and remount iff af componentf isf tof bef removedf fromf thef board,f itf isf recommendedf thatf localizedf heatingf bef usedf andf thef maximumf bodyf temperaturesf off anyf surfacef mountf componentfonfthefboardfnotfexceedf200c.fthisfmethodf willfminimizefmoisturefrelatedfcomponentfdamage.fiffanyf componentftemperaturefexceedsf200c,fthefboardfmustf befbakedfdryfperf4-2fpriorftofreworkfand/orfcomponentf removal.fcomponentftemperaturesfshallfbefmeasuredfatf theftopfcenterfoffthefpackagefbody.fanyfsmdfpackagesf thatfhavefnotfexceededftheirffoorflifefcanfbefexposedftof afmaximumfbodyftemperaturefasfhighfasftheirfspecifedf maximumfrefowftemperature. removal for failure analysis notf followingf thef abovef requirementsf mayf causef moisture/refowf damagef thatf couldf hinderf orf com - pletelyf preventf thef determinationf off thef originalf failuref mechanism. baking of populated boards somefsmdfpackagesfandfboardfmaterialsfarefnotfableftof withstandflongfdurationfbakesfatf125c.fexamplesfoffthisf arefsomeffr-4fmaterials,fwhichfcannotfwithstandfaf24fhrf bakef atf 125c.f batteriesf andf electrolyticf capacitorsf aref alsof temperaturef sensitive.f withf componentf andf boardf temperaturef restrictionsf inf mind,f choosef af bakef tem - peratureffromftablef4-1finfj-stdf033;fthenfdeterminefthef appropriatef bakef durationf basedf onf thef componentf tof bef removed.f forf additionalf considerationsf seef ipc-7711f andipc-7721. derating due to factory environmental conditions factoryf foorf lifef exposuresf forf smdf packagesf removedf fromfthefdryfbagsfwillfbefaffunctionfoffthefambientfenvi - ronmentalf conditions.f af safe,f yetf conservative,f handlingf approachfisftofexposefthefsmdfpackagesfonlyfupftofthef maximumftimeflimitsfforfeachfmoisturefsensitivityflevelfasf shownfinftablef6.fthisfapproach,fhowever,fdoesfnotfworkf ifftheffactoryfhumidityforftemperaturefisfgreaterfthanfthef testingfconditionsfoff30/60%frh.fafsolutionfforfaddress - ingfthisfproblemfisftofderatefthefexposureftimesfbasedfonf thef knowledgef off moisturef difusionf inf thef componentf packagef materialsf ref.f jesd22-a120).f recommendedf equivalentftotalffoorflifefexposuresfcanfbefestimatedfforf af rangef off humiditiesf andf temperaturesf basedf onf thef nominalfplasticfthicknessfforfeachfdevice. tablef8flistsfequivalentfderatedffoorflivesfforfhumiditiesf rangingffromf20-90%frhfforfthreeftemperature,f20,f25,f andf30c. thisf tablef isf applicablef tof smdsf moldedf withf novolac,f biphenylforfmultifunctionalfepoxyfmoldfcompounds.fthef followingfassumptionsfwerefusedfinfcalculatingftablef9: 1.f activationf energyf forf difusionf =f 0.35evf (smallestf knownfvalue). 2.f forf 60%f rh,f usef difusivityf =f 0.121expf (f -0.35ev/kt)f mm2/sff(thisfusedfsmallestfknownfdifusivityf@f30c). 3.f forf >60%f rh,f usef difusivityf =f 1.320expf (f -0.35ev/kt)f mm2/sff(thisfusedflargestfknownfdifusivityf@f30c).
table 8. recommended equivalent total floor life (days) @ 20 c , 25 c & 30 c forficsfwithfnovolac,fbiphenylfandfmultifunctionalfepoxies. f (refowfatfsameftemperaturefatfwhichfthefcomponentfwasfclassifed) maximum percent relative humidity package type and body thickness moisture sensitivity level 5% 10% 20% 30% 40% 50% 60% 70% 80% 90% bodyfthickness f 3.1fmm including pqfpsf>84fpin, plccsf(square) allfmqfps or allfbgasf1fmm levelf2a 60 78 103 41 53 69 33 42 57 28 36 47 10 14 19 7 10 13 6 8 10 30 25 20 levelf3 10 13 17 9 11 14 8 10 13 7 9 12 7 9 12 5 7 10 4 6 8 4 5 7 30 25 20 levelf4 5 6 8 4 5 7 4 5 7 4 5 7 3 5 7 3 4 6 3 3 5 2 3 4 2 3 4 30 25 20 levelf5 4 5 7 3 5 7 3 4 6 2 4 5 2 3 5 2 3 4 2 2 3 1 2 2 1 2 3 30 25 20 levelf5a 2 3 5 1 2 4 1 2 3 1 2 3 1 2 3 1 2 2 1 1 2 1 1 2 1 1 2 30 25 20 bodyf2.1fmm fthickness <3.1fmmfincluding plccsf(rectangular) 18-32fpin soicsf(widefbody) soicsf20fpins, pqfpsf80fpins levelf2a 86 148 39 51 69 28 37 49 4 6 8 3 4 5 2 3 4 30 25 20 levelf3 19 25 32 12 15 19 9 12 15 8 10 13 7 9 12 3 5 7 2 3 5 2 3 4 30 25 20 levelf4 7 9 11 5 7 9 4 5 7 4 5 6 3 4 6 3 4 5 2 3 4 2 2 3 1 2 3 30 25 20 levelf5 4 5 6 3 4 5 3 3 5 2 3 4 2 3 4 2 3 4 1 2 3 1 1 3 1 1 2 30 25 20 levelf5a 2 2 3 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 1 2 0.5 1 2 0.5 1 1 30 25 20 bodyfthickness <2.1fmm including soicsf<18fpin allftqfps,ftsops or allfbgasf<1fmmfbody thickness levelf2a 28 1 2 2 1 1 2 1 1 1 30 25 20 levelf3 11 14 20 7 10 13 1 2 2 1 1 2 1 1 1 30 25 20 levelf4 9 12 17 5 7 9 4 5 7 3 4 6 1 2 2 1 1 2 1 1 1 30 25 20 levelf5 13 18 26 5 6 8 3 4 6 2 3 5 2 3 4 1 2 2 1 1 2 1 1 1 30 25 20 levelf5a 10 13 18 3 5 6 2 3 4 1 2 3 1 2 2 1 2 2 1 1 2 1 1 2 0.5 1 1 30 25 20 for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 005- 008 avago technologies. all rights reserved. av0 -0 en - july 4, 008

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